SENCORP DEBUTS NEW TECHNOLOGY AT PACK EXPO NOV 9-13, CHICAGO
HYANNIS, MA – Sencorp, the industry leader in the design and manufacture of thermoforming and sealing machinery, unveils three innovative new machines: the 25Hundred/ULTRA thermoformer; HP/BASIC inline heat sealer; and F20/PLUS shuttle sealer. In addition, Sencorp will display their industry leading CeraTek brand laboratory pouch, bag, and tray sealers, and the HP/Flex Enviroshell sustainable package sealers.